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High Relative Density Electronic Gases Purity 99.9% Hexafluoroethane F116

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High Relative Density Electronic Gases Purity 99.9% Hexafluoroethane F116

Brand Name : newradar
Model Number : N/A
Certification : ISO/DOT/GB
Place of Origin : China
MOQ : 1000 kilogram
Price : negotiation
Payment Terms : L/C, , T/T, Western Union, MoneyGram
Supply Ability : 3,00 ton per month
Delivery Time : 15-25 working days after received your payment
Packaging Details : standard export packing:each cylinder to be protected by two poly-nets,standing on wooden pallet wrapped by plastic film
Health risks : high relative density
IPCC list of greenhouse gases. : yes
Other Names : Carbon hexafluoride, 1,1,1,2,2,2-Hexafluoroethane, Perfluoroethane, Ethforane, Halocarbon 116, PFC-116, CFC-116, R-116, Arcton 116, Halon 2600
Appearance : Colorless Liquefied Gas
UN NO. : 2193
Grade Standard : Electron Grade Industrial Grade
Synonyms : 1,1,1,2,2,2-Hexafluoroethane;C2F6;ethane,hexafluoro-;Ethylhexafluoride;f116;F-116;FC1160;Fluorocarbon 116
Application : Electronics equipment,transformer,refrigerating fluid
MF : C2F6
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Purity 99.9% Hexafluoroethane, F116 For Etching Of Silicon Dioxide Over Silicon

Description:


Hexafluoroethane can be used in a multi-functional etching technology, common in the production of semiconductors. It can be used for metal silicide and metal oxide and selective etching with respect to its metal matrix. In addition, it is also used to etch silicon on silicon.


Hexafluoroethane can be used together with trifluoromethane for refrigerant R508A (hexafluoroethane 61%) and R508B (hexafluoroethane 54%).


Specifications:


1. Physical properties


Commodity

Hexafluoroethane

Molecular Formula

R116

CAS No

76-16-4

UN No.


2193

Hazardous Class

2.2

MF:

C2F6

Cylinder Capacity

40L, 500L

Filling Weight

530kg/500L refillable cylinder

20kg/40L refillable cylinder

Storage and Transportation

Use, store and transport below 45C. Store in cool and well-ventilated areas. Keep away from fire, heat, sunlight and flammable substances. Handle carefully when loading and unloading to avoid damages to gas cylinders and accessories.


2. Typical technical data


Purity, %≥99.8
Moisture, PPm≤10
Acidity, PPm≤1
Vapor Residue, PPm≤100
AppearanceColorless, No turbid
OdorNo Strange Stench

Molecular Weight66.1
Boiling Point, °C-24.7
Critical Temperature, °C113.5
Critical Pressure, Mpa4.58
Specific Heat of Liquid, 30°C, [KJ/(kg°C)]1.68
ODP0
GWP0.014

Applications:


Multi - Functional Etching TechnologyIn The Production Of Semiconductor etching of metal
The Metal Substrate

It can be used in the selective etching of metal silicon metal and metal oxide.

Under prolonged exposure to fire or intense heat the containers may rupture violently and rocket.



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